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The quick progress in communication technologies demands superior electromagnetic interference (EMI) shielding materials. However, achieving a high shielding effectiveness (SE) with thin films, which is needed for microscale, flexible, and wearable devices, through absorption of EM radiation remains a challenge. 2D titanium carbide MXene, Ti3C2Tx, has been shown to efficiently reflect electromagnetic waves. In this paper, we investigated the electromagnetic shielding of ultrathin printed Ti3C2Tx films and recorded absorption up to 50% for 4 nm-thick films. This behavior is explained by impedance matching. Analysis of the sheet impedance in the X-band frequency range allows us to correlate the EMI shielding mechanism with the electrical conductivity measured within the same range. The average bulk in-plane conductivity for 4 to 40 nm-thick films reaches 106 S/m, while the average relaxation time is estimated at around 2.3 ps. Our figures of merit are similar to those reported for ultrathin metal films, such as gold, showing that an abundant MXene material can replace noble metals. We demonstrate that the MXene conductivity mechanism does not change from direct current to THz. The conventional method of reporting EMI SE is correlated with absolute values of transmitted, reflected, and absorbed power, which allows us to interpret previous results on MXene EMI shielding. Considering the easy deposition of thin MXenes films from solution onto a variety of surfaces, our findings offer an attractive alternative for shielding microscale devices and personal electronics.